Display substrate, method of manufacturing the same and display device having the same

ABSTRACT

A display substrate includes a substrate, a first capacitor electrode, a dielectric layer, a second capacitor electrode, and a transparent conductive electrode. The substrate includes an effective display region and a non-effective display region that surrounds the effective display region. The first capacitor electrode is in the non-effective display region. The dielectric layer is on the first capacitor electrode. The second capacitor electrode is on the dielectric layer corresponding to the first capacitor electrode. The transparent conductive electrode is positioned substantially in the effective display region. Therefore, the number of elements is decreased so that a size and a manufacturing cost of a display device are reduced.

CROSS REFERENCE

This patent application is a Divisional application of U.S. applicationSer. No. 11/479,629, filed Jun. 30, 2006, which application claimspriority to and the benefit of Korean Patent Application No. 2005-58314,filed on Jun. 30, 2005, the disclosure of which are hereby incorporatedherein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a display substrate, a method ofmanufacturing the display substrate, and a display device having thedisplay substrate. More particularly, the present invention relates to adisplay substrate capable of decreasing the number of elements, a methodof manufacturing the display substrate and a display device having thedisplay substrate.

2. Description of the Related Art

A display device such as a liquid crystal display (LCD) device, anorganic light emitting display (OLED) device, etc., in general, includesa display panel for displaying an image and a circuit board for applyingdriving signals to the display panel.

The circuit board changes externally provided image signals into drivingsignals, which are applied to the display panel through the circuitboard. The circuit board includes a flexible printed circuit (FPC) thathas a plurality of elements such as a driving integrated circuit (IC), aplurality of capacitors, etc. When a number of elements are integratedon the circuit board, the size of the circuit board is increased, andits structure is relatively complex.

SUMMARY OF THE INVENTION

The present invention provides a display substrate capable of decreasingthe number of elements.

The present invention also provides a method of manufacturing the abovedisplay substrate.

The present invention also provides a display device having the abovedisplay substrate.

A display substrate in accordance with one embodiment of the presentinvention includes a substrate, a first capacitor electrode, adielectric layer, a second capacitor electrode and a transparentconductive electrode. The substrate includes an effective display regionand a non-effective display region that surrounds the effective displayregion. The first capacitor electrode is in the non-effective displayregion. The dielectric layer is on the first capacitor electrode. Thesecond capacitor electrode is on the dielectric layer corresponding tothe first capacitor electrode. The transparent conductive electrode ispositioned substantially in the effective display region.

A method of manufacturing a display substrate in accordance with oneembodiment of the present invention is provided as follows. A metal thinfilm is formed on a substrate having an effective display region and anon-effective display region. The metal thin film is patterned to form afirst capacitor pattern in the non-effective display region. Adielectric layer is formed on the substrate having the first capacitor.A transparent conductive thin film is formed on the dielectric layer.The transparent conductive thin film is patterned to form a secondcapacitor electrode on the dielectric layer corresponding to the firstcapacitor electrode in the non-effective display region, and atransparent electrode in the effective display region.

A display device includes a first display substrate, a second displaysubstrate, a liquid crystal layer and a circuit board. The first displaysubstrate includes a substrate, a first capacitor electrode, adielectric layer, a second capacitor electrode and a transparentconductive electrode. The substrate includes an effective display regionand a non-effective display region that surrounds the effective displayregion. The first capacitor electrode is in the non-effective displayregion. The dielectric layer is on the first capacitor electrode. Thesecond capacitor electrode is on the dielectric layer corresponding tothe first capacitor electrode. The transparent conductive electrode ispositioned substantially in the effective display region. The seconddisplay substrate includes a transparent substrate, a plurality ofpixels, a first signal line, a second signal line, and a plurality ofthird signal lines. The transparent substrate corresponds to thesubstrate. The pixels are on the transparent substrate, and correspondto the transparent conductive electrode. The first signal line iselectrically connected to the transparent conductive electrode. Thesecond signal line is electrically connected to the second capacitorelectrode. The third signal lines are electrically connected toassociated pixels. The liquid crystal layer is interposed between thefirst and second display substrates. The circuit board is electricallyconnected to the first, second, and third signal lines.

According to embodiments of the present invention, the capacitor for thecircuit board is formed on the display substrate. Electric charge maythus be charged or discharged in the capacitor, thereby decreasing thenumber of the elements of the circuit board. Therefore, the size of thedisplay device is decreased, and a manufacturing cost of the displaydevice is reduced.

DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present invention will become moreapparent by describing in detail exemplary embodiments thereof withreference to the accompanying drawings, in which:

FIG. 1 is a plan view showing a display substrate in accordance with oneembodiment of the present invention;

FIG. 2 is a cross-sectional view taken along a line I-I′ shown in FIG.1;

FIG. 3 is a cross-sectional view showing a display substrate inaccordance with another embodiment of the present invention;

FIG. 4 is a cross-sectional view showing a display substrate inaccordance with another embodiment of the present invention;

FIG. 5 is a cross-sectional view showing a method of manufacturing adisplay substrate in accordance with one embodiment of the presentinvention;

FIG. 6 is a cross-sectional view showing a first capacitor electrode onthe substrate shown in FIG. 5;

FIG. 7 is a cross-sectional view showing a dielectric layer such as anorganic layer on the first capacitor electrode shown in FIG. 6;

FIG. 8 is a cross-sectional view showing a transparent conductive thinfilm on the substrate shown in FIG. 7;

FIG. 10 is a cross-sectional view showing a method of manufacturing adisplay substrate in accordance with another embodiment of the presentinvention; and

FIG. 10 is a cross-sectional view showing a method of manufacturing adisplay substrate in accordance with another embodiment of the presentinvention; and

FIG. 11 is a cross-sectional view showing a display device in accordancewith one embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

The invention is described more fully hereinafter with reference to theaccompanying drawings, in which embodiments of the invention are shown.This invention may, however, be embodied in many different forms andshould not be construed as limited to the embodiments set forth herein.Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully describe the invention to thoseskilled in the art. In the drawings, the size and relative sizes oflayers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention. Use of the term “first”does not imply that a “second” or other additional element is required.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “includes,”“including,” “comprises” and/or “comprising,” when used in thisspecification, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Embodiments of the invention are described herein with reference toschematic illustrations of idealized embodiments (and intermediatestructures) of the invention. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments of theinvention should not be construed as limited to the particular shapes ofregions illustrated herein but are to include deviations in shapes thatresult, for example, from manufacturing. For example, an implantedregion illustrated as a rectangle will, typically, have rounded orcurved features and/or a gradient of implant concentration at its edgesrather than a binary change from implanted to non-implanted region.Likewise, a buried region formed by implantation may result in someimplantation in the region between the buried region and the surfacethrough which the implantation takes place. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the actual shape of a region of a device, andare not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Hereinafter, the present invention will be described in detail withreference to the accompanying drawings.

FIG. 1 is a plan view showing a display substrate in accordance with oneembodiment of the present invention. FIG. 2 is a cross-sectional viewtaken along a line I-I′shown in FIG. 1.

Referring to FIGS. 1 and 2, the display substrate 100 includes asubstrate 10, a first capacitor electrode 20, a dielectric layer 30, asecond capacitor electrode 40 and a transparent electrode 50.

For example, the substrate 10 includes a transparent glass substrate.The substrate 10 may have a substantially quadrangular shape when viewedon a plane.

The substrate 10 includes an effective display region EDR and anon-effective display region NEDR. For example, the non-effectivedisplay region NEDR may correspond to a peripheral portion of thesubstrate 10, and may have a band shape. In FIGS. 1 and 2, thenon-effective display region NEDR of substrate 10 is positioned on theperipheral region of the substrate 10 and has a closed loop shape. Thenon-effective display region NEDR surrounds the effective display regionEDR.

The first capacitor electrode 20 is on the substrate 10. The dielectriclayer 30 is on the first capacitor electrode 20. The second capacitorelectrode 40 is on the dielectric layer 30. The first capacitorelectrode 20, the dielectric layer 30 and the second capacitor electrode40 form a capacitor, and an electric charge is stored in the capacitor.

The first capacitor electrode 20 is in the non-effective display regionNEDR of the substrate 10. For example, the first capacitor electrode 20may be positioned along the non-effective display region NEDR A width W1of the first capacitor electrode 20 may be substantially same as a widthW2 of the non-effective display region NEDR.

The first capacitor electrode 20 may have a closed loop shape that issubstantially the same as the non-effective display region NEDR. Thefirst capacitor electrode 20 may be formed using a material including ametal. Examples of metals that may be used for the first capacitorelectrode 20 include chromium, chromium oxide, etc.

The dielectric layer 30 is on the first capacitor electrode 20. Thedielectric layer 30 may include a dielectric material. Examples ofdielectric materials that may be used for the dielectric layer 30include silicon oxide, silicon nitride, organic materials, etc. Thedielectric layer 30 functions as a dielectric material to store theelectric charge applied through the first and second capacitorelectrodes 20 and 40.

The transparent electrode 50 may be positioned substantially in theeffective display region EDR. That is, most of transparent electrode 50may be positioned in the effective display region EDR, while one or moreportions of transparent electrode 50 may extend into the non-effectivedisplay region NEDR, as shown in FIG. 1. The transparent electrode 50may include transparent conductive material. Examples of transparentconductive material that, may be used for the transparent electrode 50include indium tin oxide (ITO), indium zinc oxide (IZO), amorphousindium tin oxide (a-ITO), etc.

In operation, a driving signal for displaying an image is applied to thetransparent electrode 50. A charging signal or a discharging signal isapplied to the second capacitor electrode 40. The transparent electrode50 is spaced apart from the second capacitor electrode 40.

The driving signal may be applied to the transparent electrode 50through a conductive connector (not shown). However, when the conductiveconnector (not shown) is formed in the effective display region EDR, theopening ratio and luminance may be decreased. The image display qualityof the display substrate may thus be compromised.

In the embodiment illustrated in FIGS. 1 and 2, however, the transparentelectrode 50 includes a protruded portion 55 that protrudes from theeffective display region EDR into the non-effective display region NEDR.The second capacitor electrode 40 that corresponds to the protrudedportion 55 may include a recessed portion 47 that is spaced apart fromthe protruded portion 55 when viewed on a plane.

That is, the transparent electrode 50 includes the protruded portion 55that is protruded from the effective display region EDR into thenon-effective display region NEDR, and the second capacitor electrode 40includes a recessed portion 47 that does not overlap with the protrudedportion 55.

That is, the transparent electrode 50 includes the protruded portion 55that is protruded from the effective display region EDR into thenon-effective display region NEDR, and the second capacitor electrode 40includes a recessed portion 47 that does not overlap with the protrudedportion 55.

A black matrix 60 and a color filter 70 may also be formed in theeffective display region EDR of the display substrate 100.

The black matrix 60 is formed in the effective display region in alattice shape. The black matrix 60 includes an opaque material. Examplesof opaque materials that can be used for the black matrix 60 includechromium, chromium oxide, etc.

The black matrix 60 is formed on substantially the same layer as thefirst capacitor electrode 20. In FIGS. 1 and 2, the charging anddischarging signals are applied to the first capacitor electrode 20, andthe black matrix 60 is spaced apart from the first capacitor electrode20.

The color filter 70 is formed on the effective display region EDR of thesubstrate 10 that is exposed through openings of the black matrix 60.For example, the color filter 70 may include a red color filter, a greencolor filter, and a blue color filter.

FIG. 3 is a cross-sectional view showing a display substrate inaccordance with another embodiment of the present invention. The displaysubstrate of FIG. 3 is same as in FIGS. 1 and 2, except for dielectriclayer 35. Thus, the same reference numerals will be used to refer to thesame or like parts as those described in FIGS. 1 to 2 and furtherexplanation may be omitted.

Referring to FIG. 3, the dielectric layer 35 is formed in an effectivedisplay region EDR and a non-effective display region NEDR, and thedielectric layer 35 covers the first capacitor electrode 20. Thedielectric layer 35 may be formed using a spin coating method. Thedielectric layer 35 includes a dielectric material. Examples ofdielectric materials that can be used for the dielectric layer 35include silicon oxide, silicon nitride, etc. A color filter 70 ispositioned on the dielectric layer 35, and a transparent electrode 50 ispositioned on the color filter 70.

FIG. 4 is a cross-sectional view showing a display substrate inaccordance with another embodiment of the present invention. The displaysubstrate of FIG. 4 is same as in FIGS. 1 and 2 except for dielectriclayer 75. Thus, the same reference numerals will be used to refer to thesame or like parts as those described in FIGS. 1 to 2 and any furtherexplanations will be omitted.

Referring to FIG. 4, the dielectric layer 75 is in a non-effectivedisplay region NEDR between the first and second capacitor electrodes 20and 40. The dielectric layer 75 may be formed through a process ofmanufacturing a color filter 70. That is, the dielectric layer 75includes same material as that of the color filter 70. Since the amaterial of color filter 70 functions as the dielectric layer 75, anadditional material for the dielectric layer 75 need not be provided, sothat the structure of display substrate 100 is simplified.

Method of Manufacturing Display Substrate

FIG. 5 is a cross-sectional view showing a method of manufacturing adisplay substrate in accordance with one embodiment of the presentinvention.

Referring to FIG. 5, an effective display region EDR and a non-effectivedisplay region NEDR that surrounds the effective display region EDR areindicated for a substrate 200. The substrate 200 may be a transparentglass substrate.

FIG. 6 is a cross-sectional view showing a first capacitor electrode 215on the substrate shown in FIG. 5.

FIG. 6 is a cross-sectional view showing a first capacitor electrode 215on the substrate shown in FIG. 5.

Referring to FIGS. 5 and 6, metal layer 210 on substrate 200 ispatterned to form a first capacitor electrode 215, using aphotolithography process.

In particular, the metal layer 210 is cleaned, and a photoresist layeris coated on the metal layer 210. The photoresist layer is exposed anddeveloped to form a photoresist pattern, which acts as an etch mask. Themetal layer 210 is partially etched according to the photoresist patternto form the first capacitor electrode 215 on the substrate 200.

The first capacitor electrode 215 may be formed in the non-effectivedisplay region NEDR. The first capacitor electrode 215, a dielectriclayer, and a second capacitor electrode form a capacitor to store anelectric charge. In addition, the first capacitor electrode 215 mayblock light that leaks from one or more pixels of the substrate 200, sothat the first capacitor electrode 215 may function as an edge blackmatrix of an LCD device.

FIG. 7 is a cross-sectional view showing a dielectric layer such as anorganic layer on the first capacitor electrode shown in FIG. 6.

Referring to FIG. 7, a shadow mask 220 a is aligned on the effectivedisplay region EDR. The shadow mask 220 a has substantially the sameshape and size as the effective display region EDR. Alternatively, theshadow mask 220 a may have a larger size than the effective displayregion EDR.

A dielectric layer 220 is deposited on the first capacitor electrode 215through the shadow mask 220 a to form the dielectric layer 220. Examplesof dielectric materials that can be used for the dielectric layer 220include silicon oxide, silicon nitride, etc.

Alternatively, the dielectric layer 220 may be formed through adeposition process and a photolithography process.

That is, a dielectric thin film may first be formed in the effectivedisplay region EDR and the non-effective display region NEDR of thesubstrate 200 having the first capacitor electrode 215 using a spincoating process, a slit coating process, a chemical vapor depositionprocess, a sputtering process, etc.

A photoresist pattern (not shown) is formed on the dielectric thin filmcorresponding to the first capacitor electrode 215.

The dielectric thin film is partially etched using the photoresistpattern as an etching mask to etch the dielectric material in theeffective display region EDR, leaving the dielectric layer 220 in thenon-effective display region NEDR.

Alternatively, an organic layer (not shown) may be formed on an entireof the substrate 200 through a spin coating process, a slit coating, asputtering process, etc. In the effective display region EDR, theorganic layer may be used to provide the color filter, while in thenon-effective display region NEDR, the organic layer may function as thedielectric layer for the capacitor described herein.

FIG. 8 is a cross-sectional view showing a transparent conductive thinfilm on the substrate shown in FIG. 7.

Referring to FIG. 8, a transparent conductive thin film 230 is formed inthe effective display region EDR and the non-effective display regionNEDR of the substrate through a chemical vapor deposition process, asputtering process, etc. Examples of transparent conductive materialsthat can be used for the transparent conductive thin film 230 includeindium tin oxide (ITO), indium zinc oxide (IZO), amorphous indium tinoxide, etc.

FIG. 9 is a cross-sectional view showing a second capacitor electrodeand a transparent electrode formed by patterning the transparentconductive thin film shown in FIG. 8.

Referring to FIG. 9, a photoresist thin film (not shown) is formed onthe substrate 200 having the transparent conductive thin film 230through a spin coating process, a slit coating process, etc.

A pattern mask is aligned on the photoresist thin film (not shown), andthe photoresist thin film (not shown) is exposed through the patternmask. The photoresist thin film (not shown) is then developed to form aphotoresist pattern (not shown) on the transparent conductive thin film230. For example, the photoresist pattern (not shown) may be between theeffective display region EDR and the non-effective display region NEDR.

The transparent conductive thin film 230 is etched through thephotoresist pattern as an etching mask to form the second capacitorelectrode 235 and a transparent electrode 237 in the non-effectivedisplay region NEDR and the effective display region EDR, respectively.

The second capacitor electrode 235 is spaced apart from the transparentelectrode 237 by a predetermined distance. A protruded portion protrudesfrom the transparent electrode 237 in the effective display region EDRinto the non-effective display region NEDR. In addition, a recessedportion is formed in the second capacitor electrode 235 corresponding tothe protruded portion, and spaced apart from the protruded portion.

FIG. 10 is a cross-sectional view showing a method of manufacturing adisplay substrate in accordance with another embodiment of the presentinvention. Some of the method of manufacturing the display substrate ofFIG. 10 is the same as in FIGS. 5 to 9. Thus, the same referencenumerals will be used to refer to the same or like parts as thosedescribed in FIGS. 5 to 9 and any further explanations will be omitted.

Referring to FIG. 10, a black matrix pattern 217 may be formed from asame layer as a first capacitor electrode 215 that is in a non-effectivedisplay region NEDR. The black matrix pattern 217 is in an effectivedisplay region EDR, and has a matrix shape.

A color filter 219 is formed in the effective display region EDR. Thecolor filter 219 corresponds to an opening of the black matrix pattern217. The color filter 219 includes a red color filter, a green colorfilter and a blue color filter.

Display Device

FIG. 11 is a cross-sectional view showing a display device in accordancewith one embodiment of the present invention.

Referring to FIG. 11, the display device 500 includes a first displaysubstrate 100, a second display substrate 300 and a liquid crystal layer400.

The first display substrate 100 includes a substrate 10, a firstcapacitor electrode 20, a dielectric layer 30, a second capacitorelectrode 40 and a common electrode 50. The first display substrate 100may further include a black matrix pattern 60 and a color filter 70.

For example, the substrate 10 includes a transparent glass substrate.The substrate 10 may have a substantially quadrangular shape when viewedon a plane.

The substrate 10 includes an effective display region EDR and anon-effective display region NEDR. For example, the non-effectivedisplay region NEDR corresponds to a peripheral portion of the substrate10, and has a band shape. The non-effective display region NEDR may beon the peripheral region of the substrate 10 and may have a closed loopshape. The non-effective display region NEDR substantially surrounds theeffective display region EDR.

The first capacitor electrode 20 is on the substrate 10. The dielectriclayer 30 is on the first capacitor electrode 20. The second capacitorelectrode 40 is on the dielectric layer 30. The first capacitorelectrode 20, the dielectric layer 30 and the second capacitor electrode40 form a capacitor, and an electric charge is stored in the capacitor.

The first capacitor electrode 20 is in the non-effective display regionNEDR of the substrate 10. For example, the first capacitor electrode 20may be arranged along the non-effective display region NEDR. The firstcapacitor electrode 20 may have the closed loop shape that issubstantially the same as the non-effective display region NEDR. Thefirst capacitor electrode 20 may include a metal. Examples of metalsthat can be used for the first capacitor electrode 20 include chromium,chromium oxide, etc.

The dielectric layer 30 is on the first capacitor electrode 20. Thedielectric layer 30 may include a dielectric material. Examples ofdielectric materials that can be used for the dielectric layer 30include silicon oxide, silicon nitride, etc. The dielectric layer 30functions as a dielectric material that stores the electric charge thatis applied through the first and second capacitor electrodes 20 and 40.

The second capacitor electrode 40 is on the dielectric layer 30, whichmay comprise an organic material. The second capacitor electrode 40 mayinclude a transparent conductive material. Examples of transparentconductive materials that can be used for the second capacitor electrode40 include indium tin oxide (ITO), indium zinc oxide (IZO), amorphousindium tin oxide (a-ITO), etc.

The common electrode 50 may be in the effective display region EDR. Thecommon electrode 50 may include the transparent conductive material.Examples of transparent conductive materials that can be used for thecommon electrode 50 include indium tin oxide (ITO), indium zinc oxide(IZO), amorphous indium tin oxide (a-ITO), etc.

In operation, a driving signal for displaying an image is applied to thecommon electrode 50. A charging signal or a discharging signal isapplied to the second capacitor electrode 40. The common electrode 50 isspaced apart from the second capacitor electrode 40.

The driving signal may be applied to the common electrode 50 through aconductive connector (not shown). However, when the conductive connector(not shown) is formed on the effective display region EDR, an openingrate and a luminance may be decreased and the image display quality ofthe display substrate may be compromised.

In FIG. 11, however, the common electrode 50 includes a protrudedportion that protrudes from the effective display region EDR into thenon-effective display region NEDR. The second capacitor electrode 40that corresponds to the protruded portion may include a recessed portionthat is spaced apart from the protruded portion when viewed on a plane.

A black matrix pattern 60 may be formed in the effective display regionEDR of the display substrate 100 as a matrix shape. Examples of metalsthat can be used for the black matrix pattern 60 include chromium,chromium oxide, etc.

The black matrix pattern 60 may be formed from substantially the samelayer as the first capacitor electrode 20. The charging and dischargingsignals are applied to the first capacitor electrode 20, and the blackmatrix 60 is spaced apart from the first capacitor electrode 20.

The color filter 70 is formed on the effective display region EDR of thesubstrate 10 that is exposed through openings of the black matrixpattern 60. For example, the color filter 70 may include a red colorfilter, a green color filter and a blue color filter.

An alignment layer (not shown) having a plurality of alignment groovesmay be formed on the common electrode 50.

The second display substrate 300 includes a transparent substrate 310, athin film transistor (TFT) 320 and a pixel electrode 330 that iselectrically connected to a drain electrode (not shown) of the thin filmtransistor 320. The drain electrode (not shown) may be an outputelectrode of the thin film transistor 320.

In FIG. 11, a plurality of thin film transistors 320 is arranged on thetransparent substrate 310 in a matrix shape. For example, when aresolution of the display device 500 is 1024.times.768, the number ofthe thin film transistors 320 is about 1024.times.768.times.3.

The pixel electrodes 330 of thin film transistors 320 correspond to thecommon electrode 50 of the first display substrate 100, and areelectrically connected to the associated thin film transistors 320. Aplurality of signal lines (not shown) is electrically connected to thethin film transistors 320.

A circuit board 360 is electrically connected to the second displaysubstrate 300. The circuit board 360 applies a first driving signal tothe signal lines (not shown), and applies a second driving signal and athird driving signal to the second capacitor electrode 40 of the firstdisplay substrate 100 and the common electrode 50, respectively.

A first conductive connector 370 is positioned between the secondcapacitor electrode 40 of the first display substrate 100 and the seconddisplay substrate 300 to transmit the second driving signal to thesecond capacitor electrode 40. In addition, a second conductiveconnector 380 is positioned between the common electrode 50 of the firstdisplay substrate 100 and the second display substrate 300 to transmitthe third driving signal to the common electrode 50.

Each of the first and second conductive connectors 370 and 380 mayinclude a synthetic resin body and a metal thin film on the syntheticresin body. Alternatively, each of the first and second conductiveconnectors 370 and 380 may include a metal body. Examples of metals thatcan be used for the first and second conductive connectors 370 and 380include gold, silver, etc.

The second driving signal is applied from the second display substrate300 to the second capacitor electrode 40 through the first conductiveconnector 370 so that an electric charge is stored between the first andsecond capacitor electrodes 20 and 40. The first and second capacitorelectrodes 20 and 40 and the dielectric layer 30 form the capacitor. Inaddition, the stored electric charge may be discharged so that anelectric charge is applied to the circuit board 360.

The liquid crystal layer 400 is interposed between the first and seconddisplay substrates 100 and 300. Liquid crystal molecules of the liquidcrystal layer 400 vary their arrangement in response to an electricfield applied between the pixel electrode 330 and the common electrode50, so that the light transmittance of the liquid crystal layer 400 maybe changed, thereby displaying an image.

In FIG. 11, the capacitor is formed on the first display substrate 100.Alternatively, the capacitor may be formed on the second displaysubstrate 300.

According to embodiments of the present invention, the capacitor for thecircuit board is formed on the display substrate so that the electriccharge may be charged or discharged in the capacitor, thereby decreasingthe number of the elements of the circuit board.

This invention has been described with reference to the exemplaryembodiments. It is evident, however, that many alternative modificationsand variations will be apparent to those having skill in the art inlight of the foregoing description. Accordingly, the present inventionembraces all such alternative modifications and variations as fallwithin the spirit and scope of the appended claims.

1. A method of manufacturing a display substrate comprising: forming ametal thin film on a substrate having an effective display region and anon-effective display region; patterning the metal thin film to form afirst capacitor pattern in the non-effective display region; forming adielectric layer on the substrate having the first capacitor; forming atransparent conductive thin film on the dielectric layer; and patterningthe transparent conductive thin film to form a second capacitorelectrode on the dielectric layer positioned corresponding to the firstcapacitor electrode in the non-effective display region, and atransparent electrode positioned substantially in the effective displayregion.
 2. The method of claim 1, wherein the metal thin film comprisesat least one of chromium and chromium oxide.
 3. The method of claim 1,wherein the dielectric layer is positioned in the non-effective displayregion.
 4. The method of claim 3, wherein the dielectric layer isdirectly formed in the non-effective display region through a shadowmask.
 5. The method of claim 1, wherein the dielectric layer includes aportion positioned in the effective display region and a portionpositioned in the non-effective display region.
 6. The method of claim1, wherein the patterning of the metal thin film further comprisesforming a black matrix in the effective display region, and the methodof manufacturing the display substrate further comprises forming a colorfilter in an opening of the black matrix.